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iPhone 12 Pro
Just click on a circuit within zxw and you instantly see every component on that line
• Infused with electrically insulating CircuitSheild™ technology
● Temperature lock function
ensure long-time holding work
EMMC Chip Off Stencil uv iPhone 12 ProSingle stencil for Direct BGA eMMC eMCP (221 153 169 254 162 186 ) for reballing BGA memory eMMC EMCP chips found in phones and tablets. Specification: Material: Stainless steel Type of stencils: direct heatingApplication: Chip off unencrypted Android mobile devices commonly use chips found in this reballing stencil